ISIN: SG7BC0000007

Name of Issuer: Chip Eng Seng Corporation Ltd.

Sector: Real Estate

Country of Domicile: Singapore

Notes: Chip Eng Seng Corporation Ltd. today announced that it has partially exchanged its SGD 10250M, of its existing fixed rate bond due 2022 for new 6.50% Senior Notes due 2024.

Bond Document:- https://www.bondpdf.com/bonds/5e5a0702

Fair Value Price: https://www.bondmetric.com

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• Action Type: Partial Bond Exchange
• Announcement Date: 06-Dec-2021
• Effective Date: 06-Dec-2021
• Issue Currency: SGD
• Maturity Date: 2022
• Issue Date: *****
• Amount Outstanding: *****
• Coupon Type: Fixed
• Bond Seniority: Unsubordinated

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Associated ISINs

• US00214WAE12
• SG73C5000004

View all associated ISINs

All of the financial data available on this page is sourced from FactEntry.